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AF500-265005

Thermal Interface Products Thermal interface material, AF500, non-silicone- based, 26.25x50x0.5 mm

  • Thermal Interface Products
  • AF500-265005
  • CUI Devices
  • In Stock
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Mfr. Part #: AF500-265005

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  • Specifications

Specifications

Manufacturer CUI Devices
RoHS
Product Thermally Conductive Gap Pad
Type Thermal Pad
Material Non-Silicone Elastomer
Thermal Conductivity 3 W/m-K
Breakdown Voltage 2.5 kVAC
Color Gray
Minimum Operating Temperature - 45 C
Maximum Operating Temperature + 125 C
Length 26.25 mm
Width 50 mm
Thickness 0.5 mm
Tensile Strength 30 psi
Flammability Rating UL 94 V-0
Series AF500
Brand CUI Devices
Product Type Thermal Interface Products
Standard Pack Qty 1
Subcategory Thermal Management

ICCHIPS, where the pulse of innovation meets the heartbeat of wholesale excellence. Unveil the future of electronic components with our flagship product, the AF500-265005. As your conduit to groundbreaking technology, we stand as the bridge between visionary suppliers and pioneering manufacturers, committed to orchestrating seamless transactions that cater to the ever-evolving needs of the electronics industry.

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Please send inquiry, we will respond immediately.

Mfr. Part #: AF500-265005

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CSV or Excel file format only. Max file size: 2Mb

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