Memory ics

Memory Integrated Circuits (ICs), often referred to simply as memory ICs, are semiconductor devices designed to store and retrieve digital information in electronic systems. These ICs come in various types, each optimized for specific applications and performance characteristics. Memory ICs play a crucial role in electronic devices, including computers, smartphones, embedded systems, and more.
38396 Parts Found
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Manufacturer
Micron Technology
Description
DRAM LPDDR5 32G 1GX32 FBGA
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Tray
RoHS Status
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Manufacturer
Micron Technology
Description
DRAM DDR4 16G 2GX8 FBGA
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Reel
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Manufacturer
Micron Technology
Description
DRAM LPDDR4 8G 256MX32 FBGA DDP
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Manufacturer
Micron Technology
Description
NAND Flash TLC 512G 64GX8 VBGA
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Tray
RoHS Status
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Manufacturer
Micron Technology
Description
DRAM LPDDR4 4G 256MX16 FBGA
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Tray
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Manufacturer
Micron Technology
Description
Multichip Packages MASSFLASH/LPDDR2 8G VFBGA
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Manufacturer
Micron Technology
Description
NOR Flash SERIAL NOR 128M MT25Q 45nm IT
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Tray
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Manufacturer
Micron Technology
Description
DRAM LPDDR4 4G 128MX32 FBGA DDP
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Manufacturer
ISSI
Description
DRAM 8G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 256Mx32, 1866MHz, 200 ball BGA (10mmx14.5mm) RoHS
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Manufacturer
ISSI
Description
DRAM Automotive (Tc: -40 to +105C), 4G, 1.06-1.17/1.70-1.95V, LPDDR4, 256Mx16, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS
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Manufacturer
SkyHigh Memory
Description
eMMC 2GB e.MMC5.1 BGA 9.0 x 7.5 x 0.8 mm Industrial Grade with tray packing
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Tray
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Manufacturer
Alliance Memory
Description
DRAM LPDDR2, 4G, 128M X 32, 1.2V, 134 BALL BGA, 400MHZ, I TEMP
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Manufacturer
SkyHigh Memory
Description
eMMC 2GB e.MMC5.1 BGA 11.5 x 13 x 0.8 mm with Tray Packing: 16MB Boot Code FW
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Tray
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Manufacturer
Micron Technology
Description
NAND Flash 1TX8 NAND FLASH PLASTIC IND TEMP GREEN LBGA
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Reel
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Manufacturer
Micron Technology
Description
eMMC uSSD 1T
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Tray
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Manufacturer
Micron Technology
Description
Multichip Packages uMCP 560G
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Manufacturer
Micron Technology
Description
eMMC eMMC 512Gbit 153/196 LFBGA WT
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Manufacturer
Micron Technology
Description
DRAM LPDDR5 32G 512MX64 FBGA QDP
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Tray
RoHS Status
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Manufacturer
SkyHigh Memory
Description
eMMC 2GB e.MMC5.1 BGA 11.5 x 13 x 0.8 mm with Reel Packing: 16MB Boot Code FW
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Reel
RoHS Status
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Pricing (USD)
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Manufacturer
ISSI
Description
DRAM Automotive (Tc: -40 to +105C), 8G, 1.06-1.17/1.70-1.95V, LPDDR4, 256Mx32, 1600MHz, 200 ball BGA (10mmx14.5mm) RoHS
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