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CSPUA877ABVG

410MHz Memory, DDR2, SDRAM Surface Mount 0Â°C ~ 70Â°C 1899/12/30 1:10:00 52-CABGA (4.5x7.0) Clock Drivers 1.7 V ~ 1.9 V

Product Category: Integrated Circuits (IC Chips)
Mfr. Part #
CSPUA877ABVG
Manufacturer: Integrated Circuit Systems
Package: 52-VFBGA
Lead Free Status /RoHS Status:
Data Sheet: CSPUA877ABVG Datasheet
Inventory: In Stock

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Mfr. Part #: CSPUA877ABVG

Specifications
Product Details

Specifications

Manufacturer Integrated Circuit Systems

Product Category Application-Specific Clock/Timing ICs

Series CSPUA877A

Type Clock Drivers

Packaging Tray Alternate Packaging

Mounting-Style SMD/SMT

Package-Case 52-VFBGA

Operating-Temperature 0Â°C ~ 70Â°C

Mounting-Type Surface Mount

Output-Type Differential

Voltage-Supply 1.7 V ~ 1.9 V

Supplier-Device-Package 52-CABGA (4.5x7.0)

PLL Yes

Main-Purpose Memory, DDR2, SDRAM

Input Clock

Output Clock

Number-of-Circuits 1 Circuit

Ratio of output to input 1899/12/30 1:10:00

Differential-Input:Output Yes/Yes

Frequency-Max 410MHz

Maximum Operating Temperature + 70 C

Operating temperature range 0 C

Operating-Supply-Current 300 mA

Part-#-Aliases CSPUA877A IDTCSPUA877ABVG

Supply-Voltage-Max 1.9 V

Supply-Voltage-Min 1.7 V

Package-Case CABGA-52

Max-Output-Frequency 410 MHz

Multiply-Divide-Factor 1

Product Details

Product Description

The CSPST is a high performance Integrated Passive Device (IPD) which provides series terminations suitable for use in high speed bus applications. Eight (8) or sixteen (16) series termination versions are provided. These resistors provide excellent high frequency performance in excess of 3GHz and are manufactured to an absolute tolerance as low as Â±1%. The Chip Scale Package provides an ultra small footprint for this IPD and provides minimal parasitics compared to conventional packaging. Typical bump inductance is less than 25pH. The large solder bumps and ceramic substrate allow for standard attachment to laminate printed circuit boards without the use of underfill.

Features

â€¢ 8 or 16 integrated high frequency series terminations
â€¢ Ultra small footprint Chip Scale Package
â€¢ Ceramic substrate
â€¢ 0.35mm Eutectic Solder Bumps, 0.65mm pitch

Applications

â€¢ Series resistive bus termination
â€¢ Isolated resistor array

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Mfr. Part #: CSPUA877ABVG