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DS34S132GN+
Telecom TDM-over-Packet (TDMoP) TDMoP -40°C ~ 85°C 676-PBGA (27x27)
- Product Category: Telecom Interface ICs
- Mfr. Part # DS34S132GN+
- Manufacturer: Maxim Integrated
- Package: 676-BGA
- Lead Free Status /RoHS Status:
- Data Sheet: DS34S132GN+ Datasheet
- Inventory: In Stock
- Unit Price: Inquiry
- Quantity: -+
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Please send inquiry,we will respond immediately.
Mfr. Part #: DS34S132GN+
- Specifications
- Product Details
Specifications
Product Details
Features
â— Schottky Barrier Chipâ— Ideally Suited for Automatic Assembly
â— Low Power Loss, High Efficiency
â— Surge Overload Rating to 2 0A Peak
â— For Use in Low Voltage Application
â— Guard Ring Die Construction
â— Plastic Case Material has UL Flammability
Classification Rating 94V-O
Mechanical Data
â— Weight: 0.01 grams (approx.)â— Case: SOD-123, Molded Plastic
â— Terminals: Solder Plated, Solderable per MIL-STD-750, Method 2026
â— Polarity: Cathode Band or Cathode Notch
â— Marking: Type Number
â— Lead Free: For RoHS / Lead Free Version
ICCHIPS, where the pulse of innovation meets the heartbeat of wholesale excellence. Unveil the future of electronic components with our flagship product, the DS34S132GN+. As your conduit to groundbreaking technology, we stand as the bridge between visionary suppliers and pioneering manufacturers, committed to orchestrating seamless transactions that cater to the ever-evolving needs of the electronics industry.
Please send inquiry, we will respond immediately.
Mfr. Part #: DS34S132GN+