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IRF7324D1TRPBF

MOSFET 9A 2 P-Channel (Dual) Surface Mount -55Â°C ~ 150Â°C (TJ) 8-SOIC (0.154", 3.90mm Width) 2W HEXFETÂ® 20V

Product Category: FETs - Arrays
Mfr. Part #
IRF7324D1TRPBF
Manufacturer: IOR
Package: SOP-8
Lead Free Status /RoHS Status:
Data Sheet: IRF7324D1TRPBF Datasheet
Inventory: In Stock

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Mfr. Part #: IRF7324D1TRPBF

Specifications
Product Details

Specifications

Manufacturer IOR

Product Category FETs - Arrays

Series HEXFETÂ®

Packaging Tube Alternate Packaging

Unit-Weight 0.019048 oz

Mounting-Style SMD/SMT

Package-Case 8-SOIC (0.154", 3.90mm Width)

Technology Si

Operating-Temperature -55Â°C ~ 150Â°C (TJ)

Mounting-Type Surface Mount

Number-of-Channels 2 Channel

Supplier-Device-Package 8-SO

Configuration Dual

FET-Type 2 P-Channel (Dual)

Power-Max 2W

Transistor-Type 2 P-Channel

VDSS â€“ Drain-Source Voltage 20V

Input Capacitance 2940pF @ 15V

FET-Feature Logic Level Gate

Current-Continuous-Drain-Id-25Â°C 9A

Rds-On-Max-Id-Vgs 18 mOhm @ 9A, 4.5V

Vgs-th-Max-Id 1V @ 250Î¼A

Gate-Charge-Qg-Vgs 63nC @ 5V

Pd-Power-Dissipation 2 W

Maximum Operating Temperature + 150 C

Operating temperature range - 55 C

Fall-Time 190 ns

Rise-Time 36 ns

Vgs-Gate-Source-Voltage 12 V

ID (drain current) - 9 A

Vds-Drain-Source-Breakdown-Voltage - 20 V

Rds-On-Drain-Source-Resistance 18 mOhms

Transistor-Polarity P-Channel

Typical-Turn-Off-Delay-Time 170 ns

Turn-On Delay Time 17 ns

Qg-Gate-Charge 42 nC

Channel-Mode Enhancement

Product Details

Description

The FETKY family of co-packaged HEXFETs and Schottky diodes offer the designer an innovative board space saving solution for switching regulator applications. Generation 5 HEXFETs utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. Combining this technology with International Rectifiers low forward drop Schottky rectifiers results in an extremely efficient device suitable for use in a wide variety of portable electronics applications.
The SO-8 has been modified through a customized leadframe for enhanced thermal characteristics. The SO-8 package is designed for vapor phase, infrared or wave soldering techniques.

â— Co-packaged HEXFETÂ® Power MOSFET and Schottky Diode

â— Ideal for Mobile Phone Applications
â— Generation V Technology
â— SO-8 Footprint

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Please send inquiry, we will respond immediately.

Mfr. Part #: IRF7324D1TRPBF

IRF7324D1TRPBF

Description

â— Co-packaged HEXFETÂ® Power MOSFET and Schottky Diode

â— Co-packaged HEXFETÂ® Power MOSFET and Schottky Diode