Image is for illustrative purposes only. Please refer to product description.

PA5/HSP-B

Heat Sinks Heatspreader solution for conga-PA5 based on open silicon Intel Pentium and Celeron processors . All standoffs are with 2.7mm bore hole.

  • Heat Sinks
  • PA5/HSP-B
  • congatec
  • In Stock
  • Unit Price:
    Inquiry
  • Quantity:
    -
    +

Please send inquiry,we will respond immediately.

Mfr. Part #: PA5/HSP-B

*
*
*
Upload Your BOM File

CSV or Excel file format only. Max file size: 2Mb

empty-product
  • Specifications

Specifications

Manufacturer congatec
Product Heat Spreaders
Designed for Conga-PA5
Brand congatec
Product Type Heat Sinks
Standard Pack Qty 1
Subcategory Heat Sinks

ICCHIPS, where the pulse of innovation meets the heartbeat of wholesale excellence. Unveil the future of electronic components with our flagship product, the PA5/HSP-B. As your conduit to groundbreaking technology, we stand as the bridge between visionary suppliers and pioneering manufacturers, committed to orchestrating seamless transactions that cater to the ever-evolving needs of the electronics industry.

READ MORE

Please send inquiry, we will respond immediately.

Mfr. Part #: PA5/HSP-B

*
*
*
Upload Your BOM File

CSV or Excel file format only. Max file size: 2Mb

empty-product

Copyright © 2024 ICCHIPS ELECTRONICS PTE.LTD. All right Reserved.

PayPalWestern UnionUPSDHLFedExEMSTNTaramex