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SMX8-PLUS/HSP-B

Heat Sinks Heat spreader solution for SMARC module conga-SMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are with 2.7mm bore hole.

  • Heat Sinks
  • SMX8-Plus/HSP-B
  • congatec
  • In Stock
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Mfr. Part #: SMX8-Plus/HSP-B

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ICCHIPS, where the pulse of innovation meets the heartbeat of wholesale excellence. Unveil the future of electronic components with our flagship product, the SMX8-PLUS/HSP-B. As your conduit to groundbreaking technology, we stand as the bridge between visionary suppliers and pioneering manufacturers, committed to orchestrating seamless transactions that cater to the ever-evolving needs of the electronics industry.

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Please send inquiry, we will respond immediately.

Mfr. Part #: SMX8-Plus/HSP-B

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Upload Your BOM File

CSV or Excel file format only. Max file size: 2Mb

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