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UPD5716GR-E1-A

IC MMIC 4X2 IF SWITCH MATRIX

Product Category: RF Switches
Mfr. Part #
UPD5716GR-E1-A
Manufacturer: CEL
Package: 16-TSSOP (0.173", 4.40mm Width) Exposed Pad
Lead Free Status /RoHS Status:
Data Sheet: UPD5716GR-E1-A Datasheet
Inventory: In Stock

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Mfr. Part #: UPD5716GR-E1-A

Specifications
Product Details

Specifications

Manufacturer CEL

Product Category RF Switches

Series -

Packaging Tape & Reel (TR) Alternate Packaging

Package-Case 16-TSSOP (0.173", 4.40mm Width) Exposed Pad

Impedance 50 Ohm

Operating-Temperature -40Â°C ~ 85Â°C

Features -

Voltage-Supply 4 V ~ 5.5 V

Supplier-Device-Package 16-HTSSOP

Circuit -

Topology Absorptive

P1dB-Compression-Point -

RF-Type General Purpose

Frequency-Lower 250MHz

Frequency-Upper 2.15GHz

Isolation-Frequency 29dB @ 2.15GHz (typ)

Insertion-Loss-Frequency 6.7dB @ 2.15GHz

IIP3 -

Product Details

DESCRIPTION

NECs UPD5702TU is a silicon LD MOS IC designed for use as a power amplifier up to 2.4 GHz application. This IC consists of two stage amplifiers. The device is packaged in a low cost, surface mount 8 pin L2MM (Leadless Mini Mold) plastic package. Ideally suited for high density surface mount designs.
NECs stringent quality assurance and test procedures ensure the highest reliability and performance.

FEATURES

â€¢ MEDIUM OUTPUT POWER:
POUT = +21 dBm TYP @PIN = -2 dBm, f = 2.45 GHz
â€¢ ON CHIP OUTPUT POWER CONTROL FUNCTION
â€¢ SINGLE SUPPLY VOLTAGE:
VDS = 3.0 V TYP
â€¢ PACKAGED IN 8 PIN L2MM (2.0 X 2.2 X 0.5mm)
SUITABLE FOR HIGH- DENSITY SURFACE MOUNT

APPLICATIONS

â€¢ 1.9 GHZ Application Ex. PHS etc.
â€¢ 2.4 GHz application Ex. Bluetooth, Wireless LAN, etc.
â€¢ General purpose medium power AGC amplifier

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Please send inquiry, we will respond immediately.

Mfr. Part #: UPD5716GR-E1-A