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016160
Heat Sinks Standard heatspreader with 1mm gap pad for Qseven module conga-QMX6 with processors with LIDDED FCBGA package (PN: 016112, 016113). Threaded standoffs, M2.5.
- Product Category: Heat Sinks
- Mfr. Part # conga-QMX6/HSP1-T
- Manufacturer: congatec
- Lead Free Status /RoHS Status:
- Inventory: In Stock
- Unit Price: Inquiry
- Quantity: -+
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Please send inquiry,we will respond immediately.
Mfr. Part #: conga-QMX6/HSP1-T
- Specifications
Specifications
ICCHIPS, where the pulse of innovation meets the heartbeat of wholesale excellence. Unveil the future of electronic components with our flagship product, the 016160. As your conduit to groundbreaking technology, we stand as the bridge between visionary suppliers and pioneering manufacturers, committed to orchestrating seamless transactions that cater to the ever-evolving needs of the electronics industry.
Please send inquiry, we will respond immediately.
Mfr. Part #: conga-QMX6/HSP1-T